Search for dissertations about: "direct wafer bonding technology"

Showing result 1 - 5 of 8 swedish dissertations containing the words direct wafer bonding technology.

  2. 1. Plasma assisted low temperature semiconductor wafer bonding

    Author : Donato Pasquariello; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE

  4. 2. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Author : Martin Bring; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Abstract : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. READ MORE

  5. 3. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

    Author : Anke Sanz-Velasco; Chalmers tekniska högskola; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

    Abstract : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. READ MORE

  6. 4. Silicon and Quartz Microengineering : Processing and Characterisation

    Author : Örjan Vallin; Peter Enoksson; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; silicon; quartz; microengineering; microstructure; MEMS; wafer bonding; direct bonding; adhesion quantification; Teknisk fysik; Engineering physics; Teknisk fysik;

    Abstract : Microengineering has developed a broad range of production techniques to reduce size, increase throughput, and reduce cost of electrical and mechanical devices. The miniaturisation has also entailed entirely new opportunities. READ MORE

  7. 5. Applications of Si1-xGex alloys for Ge devices and monolithic 3D integration

    Author : Konstantinos Garidis; Per-Erik Hellström; Mikael Östling; Sten Vollebregt; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon; germanium; epitaxy; selective; pn junction; germanium on insulator; GOI; Ge PFET; bonding; monolithic; sequential; three dimensional; 3D; low temperature; Informations- och kommunikationsteknik; Information and Communication Technology;

    Abstract : As the semiconductor industry moves beyond the 10 nm node, power consumption constraints and reduction of the negative impact of parasitic elements become important. Silicon germanium (Si1−xGex) alloys have been used to amplify the performance of Si based devices and integrated circuits (ICs) for decades. READ MORE