Search for dissertations about: "electrospun scaffolds"
Showing result 1 - 5 of 11 swedish dissertations containing the words electrospun scaffolds.
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1. Composite Regenerative Scaffolds
Abstract : Regenerative medicine and tissue engineering solutions of heavily innervated tissues are at this point lacklustre. This thesis expands our knowledge of appropriate acellular scaffolds for tissue repair in general and nerve regeneration in particular. READ MORE
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2. Engineering 3D degradable pliable scaffolds for adipose tissue regeneration : Advancing cell-material interactions by understanding the influence from thermal, chemical, mechanical properties and scaffold design
Abstract : In soft tissue defects that arise due to trauma, tumor resections and complex burns, a significant loss in adipose tissue remains a considerable challenge due to the insufficient regenerative capacity of the tissue. This thesis focuses on assessing cell-material interactions between degradable 3D polymer scaffolds with different designs and adipose tissue-derived stem cells. READ MORE
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3. From a Road Less Travelled to a Worn Path: Three-Dimensional Tumour Models for Cancer Research and Therapeutics
Abstract : Cancer is the second leading cause of death among both men and women worldwide. During therecent years, three-dimensional (3D) tumour models have gained increasing interest as a pre-clinicalplatform for screening of compounds for potential use in cancer therapy. READ MORE
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4. Derivation, propagation and differentiation of human stem and progenitor cells
Abstract : Neuronal loss is a common feature of many neurological disorders, including stroke, Parkinson’s disease, Alzheimer’s disease and traumatic brain injury. Human embryonic stem cells (hESCs) and hESC-derived neural progenitors (NPs) may provide a number of new ways for studying and treating diseases and injuries in the brain. READ MORE
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5. Integration of Electrospun Materials in Microelectronic and Biomedical Applications
Abstract : This thesis demonstrates the use of electrospinning and the novel properties of electrospunmaterials in two fields.The microelectronics industry has identified thermal interface materials as one of themajor bottlenecks hindering further integration at packaging level. READ MORE