Search for dissertations about: "flip-chip"

Showing result 1 - 5 of 23 swedish dissertations containing the word flip-chip.

  2. 1. Flip chip for high frequency applications : materials aspects

    Author : Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

    Abstract : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. READ MORE

  4. 2. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Author : Li-Han Hsu; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE

  5. 3. Design, Processing, and Characterization of High Frequency Flip Chip Interconnects

    Author : Wei-Cheng Wu; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; coaxial; microwave; interconnect; transition; high frequency; microstrip; coplanar waveguide; flip chip; hot-via; packaging;

    Abstract : The demands for high frequency interconnect techniques for microwave integrated circuits (ICs) are growing with increasing operating frequencies of wireless communication systems. Interconnects have significant effect and impact on the overall system performance at high frequencies. READ MORE

  6. 4. Modelling of High Power SOI Vertical DMOS Transistors and Flip-chip Packages

    Author : Kuntjoro Pinardi; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Conductive Adhesive; self-heating; Unclamped Inductive Switching; ACA; vertical DMOS; integration; Flip-chip; UIS; SOI;

    Abstract : Part I: Vertical DMOS Transistors System level integration is a major trend in the electronic industry at the moment. For automotive applications in particular it is desirable to integrate CMOS logic circuits and different types of power devices. READ MORE

  7. 5. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

    Author : Gang Zou; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

    Abstract : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. READ MORE