Search for dissertations about: "gold alloy"

Showing result 6 - 10 of 17 swedish dissertations containing the words gold alloy.

  1. 6. Ultrafast spin, lattice, and electron dynamics in thin metallic films : in the terahertz, near-infrared, and extreme ultraviolet regimes

    Author : Vivek Unikandanunni; Stefano Bonetti; Andreas Rydh; Jurgen Lindner; Stockholms universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Terahertz; near-infrared; extreme ultraviolet; epitaxial cobalt; transient grating; field emission; gold; platinum; electron-phonon coupling; magneto-crystalline anisotropy; nanoscale dynamics; ultrafast spin dynamics; magnetic inertia; nutation; pump-probe; two-temperature model; Fowler-Nordheim tunneling; fysik; Physics;

    Abstract : In this thesis, we studied the ultrafast spin and electron dynamics triggered by electromagnetic radiation belonging to three different regions of the electromagnetic spectrum, namely terahertz, near-infrared and extreme ultraviolet. By performing pump–probe measurements, we explored the role of the lattice in ultrafast spin and electron dynamics in metallic thin films. READ MORE

  2. 7. Soft tissue integration to dental implants

    Author : Maria Welander; Göteborgs universitet; []
    Keywords : MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; connective tissue; dental implants; epithelium; gold alloy; histology; peri-implant mucosa; subcrestal placement; titanium; zirconia;

    Abstract : Soft tissue integration is a prerequisite for implant success. The role of the soft tissue barrier at implants is to provide an effective seal that protects the underlying bone and prevents access for microorganisms and their products. READ MORE

  3. 8. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves

    Author : Henrik Gradin; Göran Stemme; Peter Woias; KTH; []
    Keywords : Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; wafer bonding; Au-Si; eutectic bonding; release etching; electrochemical etching; microvalves; microactuators; shape memory alloy; SMA; NiTinol; TiNi; NiTi; cold-state reset; bias spring; gate valves; wire bonding;

    Abstract : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. READ MORE

  4. 9. Atom Probe Field Ion Microscopy of Surface Zones, Coatings and Interfaces

    Author : Anders Kvist; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Ag GaAs; ohmiccontact; Au GaAs; Schottky contact; Cu3Au; APFIM; AuGe GaAs; gradient sintering; cemented carbides; CVD;

    Abstract : This thesis is focused on developingmethods for high resolution microanalysis of coatings on a substrate, andsurface zones of a bulk sample using atom probe field ion microscopy,APFIM. The APFIM technique is described and some examples of its applications to semiconductors,cemented carbides and intermetallic compounds are given. READ MORE

  5. 10. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Author : Peng Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Abstract : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. READ MORE