Search for dissertations about: "heat transfer in printed circuit board"
Found 2 swedish dissertations containing the words heat transfer in printed circuit board.
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1. Turbulent Forced Convection Air Cooling of Electronics with Heat Sinks Under Flow Bypass Conditions
Abstract : Air cooling is still the dominant method for dissipating theheat produced by electronic components. In a typical electronicdevice, the components are situated on a Printed Circuit Board(PCB). For most applications natural convection is sufficientto cool the components. READ MORE
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2. Alternative electronic packaging concepts for high frequency electronics
Abstract : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. READ MORE