Search for dissertations about: "heterogeneous integration"

Showing result 1 - 5 of 134 swedish dissertations containing the words heterogeneous integration.

  2. 1. Wafer-level heterogeneous integration of MEMS actuators

    Author : Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Abstract : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. READ MORE

  4. 2. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves

    Author : Henrik Gradin; Göran Stemme; Peter Woias; KTH; []
    Keywords : Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; wafer bonding; Au-Si; eutectic bonding; release etching; electrochemical etching; microvalves; microactuators; shape memory alloy; SMA; NiTinol; TiNi; NiTi; cold-state reset; bias spring; gate valves; wire bonding;

    Abstract : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. READ MORE

  5. 3. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

  6. 4. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Author : Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE

  7. 5. Heterogeneous material integration for MEMS

    Author : Fredrik Forsberg; Frank Niklaus; Lina Sarro; KTH; []
    Keywords : ;

    Abstract : This thesis describes heterogeneous integration methods for the fabrication of microelectromechanical systems (MEMS). Most MEMS devices reuse the fabrication techniques that are found in the microelectronics integrated circuit industry. This limits the selection of materials and processes that are feasible for the realization of MEMS devices. READ MORE