Search for dissertations about: "high-frequency packaging"

Showing result 1 - 5 of 22 swedish dissertations containing the words high-frequency packaging.

  2. 1. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

    Author : Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. READ MORE

  4. 2. High frequency electronic packaging and components : characterization, simulation, materials and processing

    Author : Christian Johansson; Mats Robertsson; Li-Rong Zheng; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER®; permittivity; printed diode; sequential build-up; silicone elastomer; Signal processing; Signalbehandling;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. READ MORE

  5. 3. Alternative electronic packaging concepts for high frequency electronics

    Author : Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

    Abstract : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. READ MORE

  6. 4. Design, Processing, and Characterization of High Frequency Flip Chip Interconnects

    Author : Wei-Cheng Wu; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; coaxial; microwave; interconnect; transition; high frequency; microstrip; coplanar waveguide; flip chip; hot-via; packaging;

    Abstract : The demands for high frequency interconnect techniques for microwave integrated circuits (ICs) are growing with increasing operating frequencies of wireless communication systems. Interconnects have significant effect and impact on the overall system performance at high frequencies. READ MORE

  7. 5. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging

    Author : Steffen Uhlig; Mats Robertsson; Peter van Daele; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical interconnects; Optical Backplanes; ORMOCER; SBU-technology; high-frequency packaging; surface characterization; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik;

    Abstract : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. READ MORE