Search for dissertations about: "interface metallization"
Showing result 1 - 5 of 8 swedish dissertations containing the words interface metallization.
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1. Copper and Silver Metallization for High Temperature Applications
Abstract : High-temperature electrical- and morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG) semiconductors. In this context, the thermal stability of both Ag and Cu films with Ta and TaN films as diffusion barriers and/or surface-capping layers at high temperatures up to 800 oC is investigated in this thesis. READ MORE
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2. Photoemission From Si(100)/Na,K Metallization, Surface Photovoltage and Quantum Well States
Abstract : Si(100) covered by Na and K has been studied with photoemission using low photon energies (hw.... READ MORE
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3. Ultrathin Oxides in Metal-Oxide-Silicon Structures: Defects and Characterization
Abstract : The properties of metal-oxide-silicon (MOS) structures with ultrathin oxide layers (15-30 Å) have been investigated by means of electrical characterization. The characterization methods used were mainly capacitance voltage (C-V), current voltage (I-V) and constant voltage stress (I-t) measurements. READ MORE
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4. Electrical Characterization of Metal-Oxide-Silicon Structures with Ultra Thin Oxide Layers
Abstract : Metal-oxide-semiconductor (MOS) structures with very thin (2 - 4 nm) oxide layers thermally grown on silicon have been electrically characterized regarding oxide and interface defects and concerning the direct tunnel current through the oxide. This thesis comprises eight papers which deal with the appearance of oxide charge during electrical stress (papers A, D, E), the beneficial effect on the defect density of low-temperature (up to 350 °C) post-metallization annealing (PMA) (paper A, B, C, G), and the effect of temperature and choice of metal for the tunnel current (paper F, H). READ MORE
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5. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging
Abstract : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. READ MORE