Search for dissertations about: "interfacial stress"

Showing result 1 - 5 of 58 swedish dissertations containing the words interfacial stress.

  2. 1. Flexural Strengthening of Reinforced Concrete Beams Using Externally Bonded CFRP--An Innovative Method for the Application of Prestressed CFRP Laminates

    Author : Jincheng Yang; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; interfacial stress; anchorage; mesh sensitivity; externally bonded; reinforced concrete; flexural strengthening; optimization; smeared length; finite element modeling; carbon fiber reinforced polymer CFRP ; stepwise prestressing; debonding;

    Abstract : A large number of existing bridges in European countries are structurally deficient and functionally obsolete due to the deterioration of aging bridges and the lack of structural and geometric capacity to accommodate the increasing traffic volume and load levels. To meet the demand for holistic and effective strengthening techniques the SUREBRIDGE solution is proposed for the refurbishment of concrete bridges, which includes the technique of using prestressed carbon fiber reinforced polymer (CFRP) laminate as externally bonded reinforcement for flexural strengthening. READ MORE

  4. 2. Strengthening reinforced concrete structures with FRP composites

    Author : Jincheng Yang; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; GFRP; finite element analysis.; corrosion; interfacial stress; externally bonded reinforcement; self-anchorage; CFRP; debonding; concrete structures; Fibre reinforced polymer; prestressing level;

    Abstract : Civil infrastructures made of reinforced concrete (RC) play an important role in the economic activities and services of society. However, signs of deterioration and functional deficiency are commonly found in existing RC structures. Thus, there is a great demand for upgrading the capacity and performance of existing concrete structures. READ MORE

  5. 3. Exploring Biopolymer-Clay Nanocomposite Materials by Molecular Modelling

    Author : Yan Wang; Hans Ågren; Vincenzo Carravetta; KTH; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; bio-nanocomposite; interfacial mechanism; binding affinity; dimensional stability; counterions; hydration; stress-strain behavior; xyloglucan; chitosan; chitin; molecular dynamics; montmorillonite.; 生物复合材料，界面机理，分子间亲和力，材料尺寸稳定性，抗衡离子，水合作用，应力应变表现， 木葡聚糖，壳聚糖，甲壳素，分子动力学模拟，蒙脱土; bio-nanokompositer; gränsytor; affinitet; dimensionsstabilitet; jonhydrering; spännings-töjningsbeteende; xyloglukan; kitosan; kitin; molekyldynamisk; montmorillonit.; Kemi; Chemistry; Fiber- och polymervetenskap; Fibre and Polymer Science; Teknisk materialvetenskap; Materials Science and Engineering;

    Abstract : In this thesis, bio-nanocomposites made from two alternative biopolymers and montmorillonite (Mnt) clay have been investigated by molecular modelling. These biopolymers are xyloglucan (XG) and chitosan (CHS), both of which are abundant, renewable, and cost-effective. READ MORE

  6. 4. Integration of thulium silicate for enhanced scalability of high-k/metal gate CMOS technology

    Author : Eugenio Dentoni Litta; Per-Erik Hellström; Mikael Östling; Lars-Åke Ragnarsson; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thulium; silicate; TmSiO; Tm2O3; interfacial layer; IL; CMOS; high-k; ALD; Informations- och kommunikationsteknik; Information and Communication Technology;

    Abstract : High-k/metal gate stacks have been introduced in CMOS technology during the last decade in order to sustain continued device scaling and ever-improving circuit performance. Starting from the 45 nm technology node, the stringent requirements in terms of equivalent oxide thickness and gate current density have rendered the replacement of the conventional SiON/poly-Si stack unavoidable. READ MORE

  7. 5. Reliability and applications of adhesives for microsystem packaging

    Author : Zhimin Mo; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrically Conductive Adhesives; Finite Element Modeling; Reliability; Stress Analysis; Low Cycle Fatigue; Thermomechanical Fatigue; Encapsulation; Interconnection;

    Abstract : The electronics industry is one of the most dynamic, fascinating and important industries. Polymeric adhesives are widely used in electronics packaging and play a critical role. READ MORE