Search for dissertations about: "lead-free electronics"

Showing result 1 - 5 of 10 swedish dissertations containing the words lead-free electronics.

2. 1. Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

   Author : Cristina Andersson; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Reliability.; Isothermal mechanical fatigue; Tensile tests; Mechanical behavior; Electronics; Thermal fatigue; Lead-free solders; Low cycle fatigue;

   Abstract : The ever increasing amount of electronic waste, most of which ends up in landfills, has become a serious worldwide concern. In addition to this, the fact that Pb is highly toxic and harmful to humans has lead to the ban of this element from the electronics industry. READ MORE

4. 2. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

   Author : Peng Sun; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

   Abstract : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. READ MORE

5. 3. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

   Author : Sun Peng; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

   Abstract : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. READ MORE

6. 4. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

   Author : Xin Luo; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

   Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE

7. 5. On Evil Twins and Their Absent Friends

   Author : Carola Müller; Centrum för analys och syntes; []
   Keywords : intermetallic compounds; structure chemistry; lead-free electronics;

   Abstract : Knowledge on intermetallic compounds and alloys is essential for technology leaps. The latest of these, the so-called digital revolution, started the period of the information age which is characterized by fast information transfer. READ MORE