Search for dissertations about: "magnetic assembly"
Showing result 16 - 20 of 61 swedish dissertations containing the words magnetic assembly.
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16. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems
Abstract : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. READ MORE
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17. Microfluidic Compartmentalization for Smart Materials, Medical Diagnostics and Cell Therapy
Abstract : The organisation of fluids in small compartments is ubiquitous in nature, such as in the cellular composition of all life. This work explores several engineering avenues where microscale fluid compartmentalization can bring novel material properties or novel functionality in life sciences or medicine. READ MORE
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18. Integrated microsystems for continuous glucose monitoring, interstitial fluid sampling and digital microfluidics
Abstract : Interdisciplinary research between medicine and microsystem engineering creates new possibilities to improve the quality of life of patients or to further enhance the performance of already existing devices. In particular, microsystems show great potential for the realization of biosensors and sampling devices to monitor bioanalytes with minimal patient discomfort. READ MORE
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19. Microfabrication and Integration Using Sub-Picosecond Laser Pulses and Magnetic Assembly
Abstract : Microfabricated devices and systems have many exciting applications such as accelerometers for triggering the launching of airbags in cars, gyroscopes for sensing the rotations of mobile phones, and micromirror arrays for controlling light reflection in digital light projectors. These devices are currently produced using semiconductor manufacturing techniques, which are suitable for large volumes of mostly planar structures. READ MORE
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20. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems
Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE