Search for dissertations about: "microwave capacitors"
Showing result 1 - 5 of 19 swedish dissertations containing the words microwave capacitors.
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1. High Temperature Superconducting and Tunable Ferroelectric Microwave Devices
Abstract : This thesis addresses some applications of High Temperature Superconductors (HTS) and ferroelectric materials in tunable microwave devices and circuits. The work is divided into three main areas: i) modeling of multilayered structures including ferroelectric layers, ii) realization and characterization of tunable coplanar waveguides (CPW), capacitors and resonators based on ferroelectrics, and iii) an investigation of microstrip HTS K-band filters. READ MORE
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2. Wide Bandgap MMIC Technology
Abstract : Wide bandgap technology for microwave electronics has been an intense area of research during the last decade. With reas of application ranging from base station amplifiers to radar transceivers, this technology has the resources to be the basis for the next generation of high power microwave electronics. READ MORE
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3. Processing and On-Wafer Test of Ferroelectric Film Microwave Varactors
Abstract : Microwave materials have been widely used in a variety of applications ranging from communication devices to military satellite services, and the study of materials properties at microwave frequencies and the development of functional microwave materials have always been among the most active areas in solid-state physics, materials science, electrical and electronic engineering. In recent years, the increasing requirements for the development of high speed, high frequency circuits and systems require complete understanding of the properties of materials function at microwave frequencies. READ MORE
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4. Characterisation and Modelling of Graphene FETs for Terahertz Mixers and Detectors
Abstract : Graphene is a two-dimensional sheet of carbon atoms with numerous envisaged applications owing to its exciting properties. In particular, ultrahigh-speed graphene field effect transistors (GFETs) are possible due to the unprecedented carrier velocities in ideal graphene. READ MORE
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5. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing
Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. READ MORE