Search for dissertations about: "modulators silicon"
Showing result 1 - 5 of 9 swedish dissertations containing the words modulators silicon.
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1. Silicon-based Photonic Devices : Design, Fabrication and Characterization
Abstract : The field of Information and Communication Technologies is witnessing a development speed unprecedented in history. Moore’s law proves that the processor speed and memory size are roughly doubling each 18 months, which is expected to continue in the next decade. READ MORE
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2. Study on electroabsorption modulators and grating couplers for optical interconnects
Abstract : Decades of efforts have pushed the replacement of electrical interconnects by optical links to the interconnects between computers, racks and circuit boards. It may be expected that optical solutions will further be used for inter-chip and intra-chip interconnects with potential benefits in bandwidth, capacity, delay, power consumption and crosstalk. READ MORE
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3. Wafer-level processing of ultralow-loss Si3N4
Abstract : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. READ MORE
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4. Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging
Abstract : This thesis describes the development of wafer-level fabrication and packaging methods for micro-electromechanical (MEMS) devices, based on wafer-bonding.The first part of the thesis is addressing the development of a wafer-level technology that allows the use of high performance materials, such as monocrystalline silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates. READ MORE
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5. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems
Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE