Search for dissertations about: "monocrystalline silicon"
Showing result 1 - 5 of 11 swedish dissertations containing the words monocrystalline silicon.
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1. Monocrystalline-Silicon Based RF MEMS Devices
Abstract : This thesis presents novel radio-frequency microelectromechanical (RF MEMS) devices, for microwave and millimeter wave applications, designed for process robustness and operational reliability using monocrystalline silicon as structural material. Two families of RF MEMS devices are proposed. READ MORE
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2. Silicon and Quartz Microengineering : Processing and Characterisation
Abstract : Microengineering has developed a broad range of production techniques to reduce size, increase throughput, and reduce cost of electrical and mechanical devices. The miniaturisation has also entailed entirely new opportunities. READ MORE
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3. Integration and Fabrication Techniques for 3D Micro- and Nanodevices
Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE
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4. Design and fabrication of hidden hinge monocrystalline silicon micromirrors for maskless lithography
Abstract : Micromirror-based maskless lithography has recently received attention as an attractive candidate to tackle challenges associated with the continued de-vice scaling in the semiconductor industry. The micromirrors work by diffrac-tion and the requirements on planarity are very tough, e.g. peak-to-valley dif-ferences of a few nanometers. READ MORE
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5. Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging
Abstract : This thesis describes the development of wafer-level fabrication and packaging methods for micro-electromechanical (MEMS) devices, based on wafer-bonding.The first part of the thesis is addressing the development of a wafer-level technology that allows the use of high performance materials, such as monocrystalline silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates. READ MORE