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Showing result 1 - 5 of 402 swedish dissertations matching the above criteria.

  2. 1. Towards Integrated Product and Package Development

    Author : Caroline Bramklev; Förpackningslogistik; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; integrated product development; product development; package; package development;

    Abstract : The global company operates from a number of locations worldwide, resulting in implications for the transport, handling and storage of product and parts transported within the company as well as between the company divisions and suppliers and/or consumers. In these companies, the package becomes a frequently used object to complement product features and achieve an effective and efficient means of logistics. READ MORE

  4. 2. Realistic Package Opening Simulations : An Experimental Mechanics and Physics Based Approach

    Author : Eskil Andreasson; Blekinge Tekniska Högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Polymer; aluminium foil; semi-crystalline; progressive damage; Abaqus;

    Abstract : A finite element modeling strategy targeting package opening simulations is the final goal with this work. The developed simulation model will be used to proactively predict the opening compatibility early in the development process of a new opening device and/or a new packaging material. READ MORE

  5. 3. Negotiating international package deals : Swedish firms and developing countries

    Author : Pervez N. Ghauri; Uppsala universitet; []
    Keywords : SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; Business studies; Företagsekonomi;

    Abstract : .... READ MORE

  6. 4. System-on-package solutions for multi-band RF front end

    Author : Xinzhong Duo; Li-Rong Zheng; Kari Halonen; KTH; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; chip-package co-design; multi-band radio; system-on-package; Electronic structure; Elektronstruktur;

    Abstract : Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. READ MORE

  7. 5. Mechanics and Failure in Thin Material Layers : Towards Realistic Package Opening Simulations

    Author : Eskil Andreasson; Sharon Kao-Walter; Gabriella Bolzon; Blekinge Tekniska Högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; aluminium foil; FEM; LDPE; localisation; necking; polymer; progressive damage; semi-crystalline; simulation; virtual twin;

    Abstract : The final goal of this PhD-work is an efficient and user-friendly finite element modelling strategy targeting an industrial available package opening application.  In order to reach this goal, different experimental mechanical and fracture mechanical tests were continuously refined to characterize the studied materials. READ MORE