Search for dissertations about: "packaging communication"

Showing result 1 - 5 of 32 swedish dissertations containing the words packaging communication.

2. 1. EM Design for New Ultra Wide Band Technologies: Eleven Feed Baluns, Bowtie Antennas and Gap Waveguides

   Author : Syed Hasan Raza Zaidi; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Ultra-wideband; Eleven feed; gap waveguide; baluns; Multiport feeding network; power divider; ring hybrid.; packaging;

   Abstract : UWB (ultra wideband), depending on the application requirement, is usually referred to more than 500 MHz bandwidth for radio/wireless applications. Here in this thesis it is also used to denote extremely wideband antennas and components of several octaves bandwidth, particularly for high frequency applications. READ MORE

4. 2. Gap Waveguide Technology- Electromagnetic Packaging and Transitions

   Author : Astrid Algaba Brazalez; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; rectangular waveguide; packaging; transition; coplanar waveguide; microstrip; millimeter waves; gap waveguide; perfect magnetic conductor;

   Abstract : The scarcity of available frequency bands for new wireless communication systems, as well as the growing need for higher capacity, motivates the current interest in moving upwards in frequency. The millimeter wave frequencyrange is very attractive to allocate potential commercial opportunities such as short range wireless communications that allow high-speed data/video transmission, and automotive radars for both driver assistance and increasedsafety. READ MORE

5. 3. The Leader of the Pack : A Service Perspective on Packaging and Customer Satisfaction

   Author : Martin Löfgren; Anders Gustafsson; Lars Witell; Bo Edvardsson; Bo Bergman; Karlstads universitet; []
   Keywords : SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; Customer satisfaction; Kano; Packaging; Business studies; Företagsekonomi; Business Administration; Företagsekonomi;

   Abstract : Almost everything we as consumers buy in a store has a package. Packages have many functions – some, if not all, present marketers with the opportunity to gain competitive advantages. READ MORE

6. 4. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

   Author : Li-Han Hsu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

   Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE

7. 5. Millimeter-wave Transceiver ICs for Ultrahigh Data Rate Communications Using Advanced III-V and Silicon Technologies

   Author : Sona Carpenter; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; D-band; frequency multiplier; 110-170 GHz; QPSK; demodulator; I Q modulator; transmitter; high-order modulation; receiver; high data rate; single chip; SiGe BiCMOS; QAM; InP DHBT; direct conversion; Gilbert-cell mixer; millimeter-wave communication; 5G; MMIC; point-to-point radio.;

   Abstract : Today’s main driving parameter for radio transceiver research is the ability to provide high capacity while maintaining low cost, small form factor, and low power consumption. Direct conversion architectures (due to the feasibility of monolithic integration) at millimeter-wave (due to wideband availability) have attracted large interest in recent years because of their potential to meet these demands. READ MORE