Search for dissertations about: "packaging design"
Showing result 6 - 10 of 122 swedish dissertations containing the words packaging design.
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6. Food Packaging for Sustainable Development
Abstract : Packaging has been on the environmental agenda for decades. It has been discussed and debated within the society mainly as an environmental problem. Production, distribution and consumption of food and drinks contribute significant to the environmental impact. However, consumers in the EU waste about 20% of the food they buy. READ MORE
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7. Integration and Fabrication Techniques for 3D Micro- and Nanodevices
Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE
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8. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor
Abstract : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. READ MORE
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9. Evaluating the Swedish producer responsibility for packaging materials : policy design and outcome
Abstract : During the last decades the promotion of recycling of used packaging materials has become an integral part of environmental policy. In 1994, a producer responsibility ordinance was introduced for different packaging materials in Sweden. READ MORE
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10. Novel RF MEMS Switch and Packaging Concepts
Abstract : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. READ MORE