Search for dissertations about: "reduction of cost for packaging"

Showing result 1 - 5 of 7 swedish dissertations containing the words reduction of cost for packaging.

  2. 1. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Author : Li-Han Hsu; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE

  4. 2. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Author : Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Abstract :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. READ MORE

  5. 3. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging

    Author : Steffen Uhlig; Mats Robertsson; Peter van Daele; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical interconnects; Optical Backplanes; ORMOCER; SBU-technology; high-frequency packaging; surface characterization; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik;

    Abstract : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. READ MORE

  6. 4. Influence of fibre modification on moisture sorption and the mechanical properties of paper

    Author : Magnus Gimåker; Lars Wågberg; Sören Östlund; Steven Keller; KTH; []
    Keywords : ;

    Abstract : Fibre modification might be a way to improve the performance of paper, to increase its cost competiveness and enable new paper-based products to be developed. Therefore, the influence of fibre modification (with polyelectrolytes or by fibre cross-linking) on the mechanical properties of special importance for packaging paper grades was studied. READ MORE

  7. 5. A systematic approach for prioritizing software requirements

    Author : Joachim Karlsson; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Computer science; Datavetenskap;

    Abstract : In most commercial development projects, there are more candidate requirements subject to implementation than available time and resources allow for. A carefully chosen set of requirements must therefore be selected for implementation. READ MORE