Search for dissertations about: "silicon-on-insulator SOI"
Showing result 1 - 5 of 39 swedish dissertations containing the words silicon-on-insulator SOI.
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1. The Buried Oxide of Silicon on Insulator Materials
Abstract : The buried oxide of silicon on insulator (SOI) wafers plays an important role in the operation of electronic devices made on such materials. The presence of defects in the buried oxide can seriously degrade the performance of a circuit. READ MORE
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2. Implementation of Flash Analog-to-Digital Converters in Silicon-on-Insulator Technology
Abstract : High speed analog-to-digital converters (ADCs) used in, e.g., read channel and ultra wideband (UWB) applications are often based on a flash topology. The read channel applications is the intended application of this work, where a part of the work covers the design of two different types of 6-bit flash ADCs. READ MORE
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3. Submillimeter-Wave Waveguide Frontends by Silicon-on-Insulator Micromachining
Abstract : This thesis presents novel radiofrequency (RF) frontend components in the submillimeter-wave (sub-mmW) range implemented by silicon micromachining, or deep reactive ion etching (DRIE). DRIE is rapidly becoming a driving technology for the fabrication of waveguide components and systems when approaching the terahertz (THz) frequency range. READ MORE
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4. Implementation of Flash Analog-to-Digital Converters in Silicon-on-Insulator CMOS Technology
Abstract : A 130 nm partially depleted silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology is evaluated with respect to analog circuit implementation. We perform the evaluation through implementation of three flash analog-to-digital converters (ADCs). READ MORE
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5. Vertical High-Voltage Transistors on Thick Silicon-on-Insulator
Abstract : More and more electronic products, like battery chargers and power supplies, as well as applications in telecommunications and automotive electronics are based on System-on-Chip solutions, where signal processing and power devices are integrated on the same chip. The integration of different functional units offers many advantages in terms of reliability, reduced power consumption, weight and space reduction, leading to products with better performance at a hopefully lower price. READ MORE