Search for dissertations about: "silicon-on-insulator"

Showing result 21 - 25 of 51 swedish dissertations containing the word silicon-on-insulator.

  2. 21. Fabrication and Characterization of Si-on-SiC Hybrid Substrates

    Author : Ling-Guang Li; Jörgen Olsson; Örjan Vallin; Stefan Bengtsson; Uppsala universitet; []
    Keywords : hydrophilic wafer bonding; silicon on silicon carbide; hybrid substrate; oxygen out-diffusion; Engineering Science with specialization in Electronics; Teknisk fysik med inriktning mot elektronik;

    Abstract : In this thesis, we are making a new approach to fabricate silicon on insulator (SOI). By replacing the buried silicon dioxide and the silicon handling wafer with silicon carbide through hydrophilic wafer bonding, we have achieved silicon on crystalline silicon carbide for the first time and silicon on polycrystalline silicon carbide substrates at 150 mm wafer size. READ MORE

  4. 22. Silicon Integrated HBV Frequency Multipliers for THz Applications

    Author : Aleksandra Malko; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; frequency multipliers; Heterostrucutre Barrier Varactors HBVs ; THz sources; wafer bonding.; integrated circuits; heterogeneous integration; Compund semiconductors; epitaxial transfer; MICs;

    Abstract : This thesis deals with integrated varactor diode circuits for terahertz (THz) applications. In particular hybrid, monolithic microwave integrated circuits (MMICs), and heterogeneous integration are explored for frequency multiplier applications. READ MORE

  5. 23. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing

    Author : Markus Forsberg; Jörgen Olsson; Jyrki Molarius; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; chemical mechanical polishing; chemical mechanical planarization; silicon; silicon dioxide; front end; shallow trench isolation; deep trench isolation; bipolar transistor; BiCMOS; wafer bonding; Elektronik; Electronics; Elektronik;

    Abstract : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. READ MORE

  6. 24. Plasma assisted low temperature semiconductor wafer bonding

    Author : Donato Pasquariello; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE

  7. 25. Silicon device substrate and channel characteristics influenced by interface properties

    Author : Mikael Johansson; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; channel; attenuation; zro2; interface; traps; semi-insulating; high-k; mos; cross-talk; hfo2;

    Abstract : This thesis is divided in two parts, one dealing with the depleted Si/Si structure, which is a substrate behaving as a semi-insulating material intended for radio-frequency applications and the other concerning high-k gate dielectrics (dielectrics with high dielectric constant) as the replacement for silicon dioxide as MOS gate dielectric.High frequency applications of CMOS integrated circuits, to lower cost, achieve higher performance and richer functionality, depends partly on the possibility to decrease the substrate coupling between different parts of the circuit. READ MORE