Search for dissertations about: "silicon-on-insulator"

Showing result 6 - 10 of 51 swedish dissertations containing the word silicon-on-insulator.

  2. 6. Vertical High-Voltage Transistors on Thick Silicon-on-Insulator

    Author : Ulrich Heinle; Gehan Amaratunga; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; SOI; vertical DMOS; trench isolation; power electronics; integration; on-resistance; capacitive coupling; self-heating; switching; Elektronik; Electronics; Elektronik; Elektronik; Electronics;

    Abstract : More and more electronic products, like battery chargers and power supplies, as well as applications in telecommunications and automotive electronics are based on System-on-Chip solutions, where signal processing and power devices are integrated on the same chip. The integration of different functional units offers many advantages in terms of reliability, reduced power consumption, weight and space reduction, leading to products with better performance at a hopefully lower price. READ MORE

  4. 7. Microelectronic devices based on ultra-shallow junctions and silicon-on-insulator materials

    Author : Anders Söderbärg; Uppsala universitet; []
    Keywords : NATURAL SCIENCES; NATURVETENSKAP;

    Abstract : .... READ MORE

  5. 8. Wafer Bonding - Problems and Possibilities

    Author : Mats Bergh; Chalmers tekniska högskola; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SOI; atomic force microscope; micromechanics; compliant substrates; wafer bonding; semi-insulating silicon; AFM; surface chemistry; diamond; silicon on insulator; aluminium nitride; microelectronics; surface roughness;

    Abstract : The wafer bonding technology offers a unique opportunity to combine different materials. This has been used for the realisation of novel silicon on insulator (SOI) structures. By replacing the buried silicon dioxide layer with a polycrystalline diamond film the thermal properties of the SOI structure are improved. READ MORE

  6. 9. The influence of surface microroughness on wafer bonding

    Author : Mats Bergh; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; AFM; hydrophilic; surface roughness; diamond; silicon-on-insulator; poly silicon; silicon-on-diamons; atomic force microscope; wafer bonding; SOI; aluminum nitride; hydrophobic;

    Abstract : .... READ MORE

  7. 10. Silicon micromachined waveguide components for terahertz systems

    Author : Bernhard Beuerle; Joachim Oberhammer; Umer Shah; Kamal Sarabandi; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; micromachining; waveguide; terahertz; deep reactive ion etching; silicon on insulator; on-wafer characterization; InP; SiGe; Electrical Engineering; Elektro- och systemteknik;

    Abstract : This thesis presents silicon micromachined waveguide components for sub-terahertz and terahertz (THz) systems fabricated by deep reactive ion etching (DRIE). Historically the main driving force for the development of THz systems has been space-based scientific instruments for astrophysics, planetary and Earth science missions. READ MORE