Search for dissertations about: "silicon-on.insulator SOI"

Showing result 21 - 25 of 39 swedish dissertations containing the words silicon-on.insulator SOI.

2. 21. High-Speed Analog-to-Digital Converters in CMOS

   Author : Siyu Tan; Integrerade elektroniksystem; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; A D converters; CMOS circuit design; ΔΣ ADC; high-speed ADC; Nyquist-rate ADC; oversampled ADC; SAR ADC; 5G;

   Abstract : The Analog to Digital (A/D) Converters (ADC) are vital components in high-performance radio devices. In the receiver end, the signal received by the analog front-end can not be directly analyzed by the digital core, thus requiring high-performance ADC circuits acting as bridges connecting the analog and digital domain. READ MORE

4. 22. Silicon Integrated HBV Frequency Multipliers for THz Applications

   Author : Aleksandra Malko; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; frequency multipliers; Heterostrucutre Barrier Varactors HBVs ; THz sources; wafer bonding.; integrated circuits; heterogeneous integration; Compund semiconductors; epitaxial transfer; MICs;

   Abstract : This thesis deals with integrated varactor diode circuits for terahertz (THz) applications. In particular hybrid, monolithic microwave integrated circuits (MMICs), and heterogeneous integration are explored for frequency multiplier applications. READ MORE

5. 23. Plasma assisted low temperature semiconductor wafer bonding

   Author : Donato Pasquariello; Uppsala universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

   Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE

6. 24. High-Temperature Analog and Mixed-Signal Integrated Circuits in Bipolar Silicon Carbide Technology

   Author : Raheleh Hedayati; Carl-Mikael Zetterling; H. Alan Mantooth; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicon carbide SiC ; bipolar junction transistor BJT ; high temperature; SiC integrated circuit; Spice Gummel-Poon SGP ; operational amplifier opamp ; negative feedback amplifier; bandgap reference; masterslave comparator; digital-to-analog converter DAC ; analog-to-digital converter ADC ; flash ADC; successive approximation register SAR ADC; Electrical Engineering; Elektro- och systemteknik;

   Abstract : Silicon carbide (SiC) integrated circuits (ICs) can enable the emergence of robust and reliable systems, including data acquisition and on-site control for extreme environments with high temperature and high radiation such as deep earth drilling, space and aviation, electric and hybrid vehicles, and combustion engines. In particular, SiC ICs provide significant benefit by reducing power dissipation and leakage current at temperatures above 300 °C compared to the Si counterpart. READ MORE

7. 25. Exploiting the Terahertz Spectrum with Silicon Micromachining : Waveguide Components, Systems and Metrology

   Author : James Campion; Joachim Oberhammer; Umer Shah; Robert M. Weikle II; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Terahertz; Silicon Micromachining; Waveguide; Waveguide System; Metrology; Electrical Engineering; Elektro- och systemteknik;

   Abstract : The terahertz spectrum (300 GHz - 3 THz) represents the final frontier for modern electronic and optical systems, wherein few low-cost, volume-manufacturable solutions exist. THz frequencies are of great scientific and commercial interest, with applications as diverse as radio astronomy, sensing and imaging and wireless communications. READ MORE