Search for dissertations about: "termo"
Showing result 1 - 5 of 20 swedish dissertations containing the word termo.
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1. Surface characterisation of thermally modified spruce wood and influence of water vapour sorption
Abstract : Today there is growing interest within the construction sector to increase the proportion of biobased building materials made from renewable resources. By-products or residuals from wood processing could in this case be valuable resources for manufacturing new types of biocomposites. READ MORE
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2. On Model Libraries for Thermo-hydraulic Applications
Abstract : Mathematical modelling and simulation are important tools when dealing with engineering systems that today are becoming increasingly more complex. Tightly integrated production and process optimization are trends that give rise to heterogeneous systems, which are difficult to handle without expertise in several engineering disciplines. READ MORE
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3. Design and Implementation of Object-Oriented Model Libraries using Modelica
Abstract : This thesis describes basic models for thermo-fluid systems and the implementation of the models using a flexible object-oriented structure in the ThermoFluid library. Model libraries provide an excellent way to package engineering knowledge of systems to be reused by non-experts. READ MORE
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4. Silicon photonic MEMS building blocks for low-power programmable circuits
Abstract : Silicon photonics, or the confinement and control of light in integrated silicon waveguides, has rapidly grown from research labs to high-end chips for telecommunications. With the associated improvements in waveguide performance, the technology is promising for a wide range of new applications, from computing to sensing. READ MORE
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5. Towards Unconventional Applications of Wire Bonding
Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE