Search for dissertations about: "thermal interface material"
Showing result 6 - 10 of 129 swedish dissertations containing the words thermal interface material.
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6. Design of Thermal Barrier Coatings : A modelling approach
Abstract : Atmospheric plasma sprayed (APS) thermal barrier coatings (TBCs) are commonly used for thermal protection of components in modern gas turbine application such as power generation, marine and aero engines. TBC is a duplex material system consisting of an insulating ceramic topcoat layer and an intermetallic bondcoat layer. READ MORE
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7. Functional Fibers for Biomedical and Thermal Management Applications
Abstract : This thesis explores the integration of electrospun polymeric structures in two fields; fibrous scaffolds as cell culture substrates for biomedical applications and fiber carrier networks in metal matrix polymer composites as thermal interface materials in microsystems. Electrospinning has been found to carry great potential for a range of future biomedical engineering applications. READ MORE
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8. Development and Characterization of Reliable Graphene-based Materials for Lightweight and Efficient Thermal Management in Electronics
Abstract : The semiconductor industry continuously aims to increase the transistor density in integrated circuits to improve performance of electronics. As performance and transistor density increases, so does the power density of integrated circuits. READ MORE
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9. Alloys in Contact with Molten Salts for Thermal Storage Applications
Abstract : The combination of a concentrated solar power (CSP) plant and a thermal energy storage (TES) system is a promising technology for power generation, in that it overcomes the challenges commonly faced by renewable energy systems, such as intermittency, dispatchability, and the gap between the energy supply and energy demand. The third generation (Gen3) CSP plants are designed to increase plant efficiency by using supercritical carbon dioxide (sCO2) instead of steam for the Brayton cycle gas turbines, requiring a minimum operating temperature of 750°C for the TES materials. READ MORE
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10. Integration of Electrospun Materials in Microelectronic and Biomedical Applications
Abstract : This thesis demonstrates the use of electrospinning and the novel properties of electrospunmaterials in two fields.The microelectronics industry has identified thermal interface materials as one of themajor bottlenecks hindering further integration at packaging level. READ MORE