Search for dissertations about: "thesis in power IC technology"

Showing result 1 - 5 of 56 swedish dissertations containing the words thesis in power IC technology.

2. 1. Power Amplifier Circuits in CMOS Technologies

   Author : Jonas Fritzin; Atila Alvandpour; Henrik Sjöland; Linköpings universitet; []
   Keywords : TECHNOLOGY; TEKNIKVETENSKAP;

   Abstract : The wireless market has experienced a remarkable development and growth since the introduction of the first mobile phone systems, with a steady increase in the number of subscribers, new application areas, and higher data rates. As mobile phones and wireless connectivity have become consumer mass markets, a prime goal of the IC manufacturers is to provide low-cost solutions. READ MORE

4. 2. Accurate Leakage-Conscious Architecture-Level Power Estimation for SRAM-based Memory Structures

   Author : Minh Quang Do; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SRAM Power Modeling; Deep Submicron; Power-Performance Estimation Tool; VLSI; Power Estimation; DSP Architecture; CMOS; Cache Power Modeling;

   Abstract : Following Moore’s Law, technology scaling will continue providing integration capacityof billions of transistors for IC industry. As transistors keep shrinking in size, leakagepower dissipation dramatically increases and gradually becomes a first-class design constraint. READ MORE

5. 3. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Author : Shuangxi Sun; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE

6. 4. Design and Numerical Modelling of Nanoplasmonic Structures at Near-Infrared for Telecom Applications

   Author : Seyed Morteza Ebadi; Jonas Örtegren; Max Yan; Magnus Hummelgård; Carl Hägglund; Mittuniversitetet; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Surface plasmon polaritons SPPs ; resonators; photonic integrated circuits PICs ; wavelength filtering devices; MIM waveguides.; ytplasmon-polaritoner SPPs ; resonatorer; fotoniska integrerade kretsar PIC- enheter ; våglängdsfiltreringsenheter; MIM-vågledare.;

   Abstract : Industrial innovation is mostly driven by miniaturization. As a result of remarkable technological advancements in the fields of equipment, materials and production processes, transistor, the fundamental active component in conventional electronics, has shrunk in size. READ MORE

7. 5. Acoustic In-duct Characterization of Fluid Machines with Applications to Medium Speed IC-engines

   Author : Antti Hynninen; Mats Åbom; Hans Bodén; Antonio Torregrosa; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; in-duct; acoustic source; source characterization; IC-engine;

   Abstract : The unwanted sound, noise, can lead to health problems, e.g. hearing loss and stress-related problems. A pre-knowledge of noise generation by machines is of great importance due to the ever-shorter product development cycles and stricter noise legislation. READ MORE