Search for dissertations about: "thesis on thermal science"
Showing result 1 - 5 of 608 swedish dissertations containing the words thesis on thermal science.
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1. Thermal stresses in load-bearing glass-timber components
Abstract : Thermal stresses can arise in glass used in architectonic realisations in buildings as a result of solar irradiation: that is, sunlight. The magnitude of these thermal stresses depends on the temperature conditions in the glass in terms of the temperature differences between warm and cold areas. READ MORE
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2. Functional Fibers for Biomedical and Thermal Management Applications
Abstract : This thesis explores the integration of electrospun polymeric structures in two fields; fibrous scaffolds as cell culture substrates for biomedical applications and fiber carrier networks in metal matrix polymer composites as thermal interface materials in microsystems. Electrospinning has been found to carry great potential for a range of future biomedical engineering applications. READ MORE
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3. Cellulosic Thermal Insulation with Improved Water Resistance and Fire Retardancy
Abstract : Sweden is one of the largest countries by area in Europe, and almost 70% of it is covered by forest. These abundant forest resources benefit the Swedish bioeconomy, but the pulp and paper industry is facing the challenge of a decrease in the demand for printing paper due to a significant shift to electronic media; therefore, it is a priority to use pulp to produce alternative value-added products, such as thermal insulating materials in buildings. READ MORE
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4. Solution-Chemically Derived Spectrally Selective Solar Absorbers : With System Perspectives on Solar Heating
Abstract : This thesis consists of two parts, one dominating part concerning spectrally selective solar absorbers and one dealing with thermal solar systems. The appended papers I to VIII concern the solar absorber part, papers dealing with the systems part have not been included in the thesis. READ MORE
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5. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging
Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE