Search for dissertations about: "thin-film flip-chip"

Showing result 1 - 5 of 6 swedish dissertations containing the words thin-film flip-chip.

2. 1. Flip chip for high frequency applications : materials aspects

   Author : Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

   Abstract : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. READ MORE

4. 2. Thin-film ultraviolet light-emitting diodes realized by electrochemical etching of AlGaN

   Author : Michael Alexander Bergmann; Chalmers tekniska högskola; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; thin-film flip-chip; light-emitting diodes; UVB; AlGaN; thermocompression bonding; substrate removal; ultraviolet light; electrochemical etching; heterogeneous integration; LEDs;

   Abstract : Ultraviolet (UV) light sources have a direct impact on everyone’s life. They are used to sterilize surfaces as well as for water purification. In addition, they are used in green houses to enhance health-promoting substances in plants, for phototherapy to treat skin diseases, for sensing and material curing. READ MORE

5. 3. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

   Author : Gang Zou; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

   Abstract : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. READ MORE

6. 4. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

   Author : Steffen Uhlig; Linköpings universitet; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

   Abstract : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. READ MORE

7. 5. Fabrication of Electroacoustic Devices for Integrated Applications

   Author : Johannes Enlund; Ilia Katardjiev; Jörgen Olsson; Uppsala universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; Teknisk fysik; Elektronik; Electronics;

   Abstract : Electroacoustic technology has in many ways revolutionised the wireless telecommunication industry. The IC compatible fabrication technique of thin film electroacoustic devices has so far provided a considerable increase in device performance and reduction in size. At the moment, new areas where this technology can be of use is under investigation. READ MORE