Search for dissertations about: "three dimensional integration"

Showing result 1 - 5 of 90 swedish dissertations containing the words three dimensional integration.

2. 1. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Author : Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Abstract : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. READ MORE

4. 2. Applications of Si1-xGex alloys for Ge devices and monolithic 3D integration

   Author : Konstantinos Garidis; Per-Erik Hellström; Mikael Östling; Sten Vollebregt; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon; germanium; epitaxy; selective; pn junction; germanium on insulator; GOI; Ge PFET; bonding; monolithic; sequential; three dimensional; 3D; low temperature; Informations- och kommunikationsteknik; Information and Communication Technology;

   Abstract : As the semiconductor industry moves beyond the 10 nm node, power consumption constraints and reduction of the negative impact of parasitic elements become important. Silicon germanium (Si1−xGex) alloys have been used to amplify the performance of Si based devices and integrated circuits (ICs) for decades. READ MORE

5. 3. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

   Author : Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

   Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE

6. 4. The Progressive in 19th-Century English : A Process of Integration

   Author : Erik Smitterberg; Merja Kytö; Marianne Hundt; Uppsala universitet; []
   Keywords : HUMANIORA; HUMANITIES; English language; The progressive; 19th-century English; diachronic studies; corpus linguistics; syntactic variation; verb phrase; aspect; dimensions of variation; Engelska; English language; Engelska språket; English; engelska;

   Abstract : The present work is a corpus-based study of the English progressive during the 19th century. The study is based on Conce, a one-million-word corpus covering the period 1800–1900 and comprising seven genres, both speech-related and non-speech-related. READ MORE

7. 5. Spectral-element simulations of turbulent wall-bounded flows including transition and separation

   Author : Johan Malm; Dan Henningson; Philipp Schlatter; Suad Jakirlic; KTH; []
   Keywords : spectral-element method; direct numerical simulation DNS ; large-eddy simulation LES ; turbulence; transition; over-integration; three-dimensional separation; massively parallel simulations; proper orthogonal decomposition POD ; Koopman modes; vorticity stretching; coherence; SRA - E-vetenskap SeRC ; SRA - E-Science SeRC ;

   Abstract : The spectral-element method (SEM) is used to study wall-bounded turbulent flowsin moderately complex geometries. The first part of the thesis is devoted to simulations of canonical flow cases, such as temporal K-type transitionand turbulent channel flow, to investigate general resolution requirements and computational efficiency of the numerical code nek5000. READ MORE