Search for dissertations about: "wire bonding"

Showing result 1 - 5 of 16 swedish dissertations containing the words wire bonding.

  2. 1. Towards Unconventional Applications of Wire Bonding

    Author : Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

    Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE

  4. 2. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

    Author : Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

    Abstract : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. READ MORE

  5. 3. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves

    Author : Henrik Gradin; Göran Stemme; Peter Woias; KTH; []
    Keywords : Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; wafer bonding; Au-Si; eutectic bonding; release etching; electrochemical etching; microvalves; microactuators; shape memory alloy; SMA; NiTinol; TiNi; NiTi; cold-state reset; bias spring; gate valves; wire bonding;

    Abstract : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. READ MORE

  6. 4. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

  7. 5. Wafer-level heterogeneous integration of MEMS actuators

    Author : Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Abstract : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. READ MORE