Integration and Packaging Concepts for Infrared Bolometer Arrays

Abstract:   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. Ongoing research has continuously reduced the system cost. Apart from decreasing the cost of infrared optics, there are other key issues to achieve acceptable system costs, including wafer-level vacuum packaging of the detectors, low vacuum level operation, and the use of standard materials in the detector fabrication. This thesis presents concepts for cost reduction of low-end IR cameras.      The thesis presents a study of detector performance based on the thermal conductance design of the pixel. A circuit analog is introduced to analyze the basic thermal network effect from the surrounding environment on the conductance from the pixel to the environment. A 3D simulation model of the detector array conductance has been created in order to optimize the performance of the arrays while operated in low vacuum. In the model, Fourier's law of heat transfer is applied to determine the thermal conductance of a composite material pixel. The resulting thermal conductance is then used to predict the performance of the detector array in low vacuum.      The investigations of resist as the intermediate bonding material for 3D array integration are also reported in the thesis. A study has been made of the nano-imprint resists series mr-I 9000 using a standard adhesive wafer bonding scheme for thermosetting adhesives. Experiments have been performed to optimize the thickness control and uniformity of the nano-imprint resist layer. The evaluation, including assessment of the bonding surface uniformity and planarizing ability of topographical surfaces, is used to demonstrate the suitability of this resist as sacrificial material for heterogeneous detector array integration.      Moreover, the thesis presents research in wafer-level packaging performed by room temperature bonding. Sealing rings, used to create a cavity, are manufactured by electroplating. The cavity sealing is tested by liquid injection and by monitoring the deflection of the lid membrane of the cavities. A value for the membrane deflection is calculated to estimate the pressure inside the cavities.