High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

University dissertation from Chalmers University of Technology

Author: Markus Dernevik; Chalmers Tekniska Högskola.; Chalmers University Of Technology.; [1998]

Keywords: TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrically conductive adhesives; isotopic adhesives; anisotropic adhesives; flip-chip; interconnections; microwaves; surface mount technology; printed wire board; printed cirquit board; multilayer; sequential build-up board;

Abstract:

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